碲化锡的制备、结构、性质及红外光电探测研究进展(特邀)

Preparation, structure and properties of tin telluride and its research progress in infrared photodetection (Invited)

  • 摘要: Ⅳ-Ⅵ族碲化锡化合物是直接带隙半导体材料,在室温和大气压条件下具有稳定存在的面心立方结构。作为拓扑晶体绝缘体,碲化锡具有高度对称的晶型结构、螺旋形的多重表面态和强健的拓扑保护特性、无带隙的拓扑表面态和窄带隙体态、室温下高的迁移率等优异性能,在制备无能耗、宽谱(从紫外光、可见光到红外光)、超快响应的新型光电探测器领域有巨大潜力。文中从适宜应用于光电探测器件的角度出发,对碲化锡材料的制备方法、晶体结构、性质进行了阐述,对近年来碲化锡在红外光电探测领域的研究进展进行了总结,展望了其在光电探测领域的发展前景,并提出了碲化锡作为光电器件亟需深入研究的几个方面。

     

    Abstract: As Ⅳ-Ⅵ compound, tin telluride belongs to direct band gap semiconductor materials. Under the condition of room temperature and atmospheric pressure, tin telluride has a stable face-centered cubic crystal structure. Being a topological crystal insulator, tin telluride has a highly symmetrical crystal structure. Due to its helical multiple surface states and strong topological protection characteristics, tin telluride can be used to fabricate new electronic devices without energy consumption. Moreover, on account of its excellent properties such as band-gap free topological surface state and narrow band gap posture, it has great potential in the field of preparing new photodetectors with wide spectral response from ultraviolet, visible light to infrared. In addition, because of its high mobility at room temperature, tin telluride is expected to be used for high performance photoelectric detection with ultra-fast response speed. In this review, the preparation methods, crystal structures and properties of tin telluride materials were summarized from the point of view that they were suitable for photodetectors. And the research progress of tin telluride in infrared photoelectric detection in recent years was summarized. Then the development potential of tin telluride in the field of photodetectors was prospected, and several aspects that need to be further studied as photodetectors were also put forward.

     

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