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未来光电导引头将向光学多模、微波/红外、毫米波/红外/激光等多模复合化发展,其电子系统涉及各种传感器信号、图像、激光、雷达等多波段、多体制实时信息处理融合一体的复杂局面,对于光学成像/主被动多模复合导引头,需要实现光学探测成像、微波探测、目标识别和稳定平台控制等多种功能,对于以光学成像为基础的多模复合导引头,通常需要对微波或者激光信号进行采集、处理和目标检测识别。微波中频信号处理、基带信号处理、图像处理等大多是采用DSP+FPGA的模式,具有极大的数字信号处理同构性[10],为了实现集成小型化,降低系统的复杂性,实现信息融合,光电导引头信息处理一体化设计是未来的必然发展趋势。
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结合光电导引头目标探测组件、自动目标识别跟踪、稳定平台综合控制等电子功能部件组成,综合分析采用分布式模块化方法设计构建的典型光电导引头信息处理系统,存在大量DSP、FPGA、存储器、LDO电源等信号和信息处理硬件重复性设计,增加了大量部件之间不必要的通信和数据交换,造成了极大的硬件资源浪费,显著增加了电源消耗、体积空间占用和总重量,信息处理系统综合成本更是居高不下。
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在大规模集成电路先进制造工艺支撑下,数字信号处理领域出现了内存容量大、数据传输带宽高、外设丰富、功耗低的高性能多核DSP芯片。FPGA实现了多达九百万级系统逻辑单元高密度和灵活丰富的I/O资源、内嵌增强型DSP内核具有超强的并行计算性能。新一代DSP和FPGA还与ARM处理器集成,推出了多核DSP+多核ARM、FPGA+ARM异构的SoC系统级单芯片,提供了无与伦比的系统性能、灵活性和可扩展性。高速DDR3/DDR4可以支持系统大容量存储器扩展需求。这些技术的革新与成熟应用强烈地推动着光电导引头信息处理集成小型化设计实现。
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综合分析集成小型化需求和光电导引头电子部件技术特点,兼顾集成与分散的优点,遵循功能综合集成核心原则,结合技术的可实现性。根据红外探测器、激光接收机、导引头陀螺、旋变或电位计等传感器总体布局进行信号采集集成设计,分别完成传感器信号采集、调理、放大、滤波和数字化处理。信息处理集成系统是导引头集成小型化核心,主要是完成数字信号实时处理、红外探测成像非均匀性校正、激光信息处理、自动目标检测识别跟踪、伺服平台稳定控制、视线角信息数据解算、信息融合处理、复合抗干扰算法、系统各种工作参数管理、与弹载计算机的信息交互和系统任务管理等功能。构建了如图6所示的高性能集成小型化信息处理系统。
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针对图6所示的集成小型化信息处理机总体架构,可以通过主要器件的合理选型,实现如表1所示的性能指标[11]。
Performance Device reference Remarks Computing performance 8 TMS320C66x DSP Core Subsystems (C66x CorePacs)
4 ARM® Cortex® -A15 MPCoreTM Processors
DSP: 1.2 GHz×8=9.6 GHz
ARM: 1.4 GHz×4=5.6 GHz
Integer (Instructions) 19600 DMIPS
Fixed Point 307.2 GMACS
Floating Point 198.4 GFLOPS66AK2Hxx TI DSP
DSP+ARMMax 3528 DSP Slices
6.3 TeraMACs of DSP compute performanceXCKUxxP XILINX FPGA
UltraScale+Logic timing Up to 1.2M system logic cells
Up to 11 CMTsMemory 8 MB Local L2 Cache
6 MB Multicore Shared Memory (SRAM)On DSP chip 4 MB Local L2 Cache On ARM chip 2 GBytes DDR3
2 Gbits NOR FLASHMT41K512M16
MT25QU02GcBBExternal
extensionSignal acquisition 16 Bits, Up to 500 kSPS, 8 channels, ±20.48 V maximum ADAS3023 Interface expansion CameraLink, PAL, RS422, CAN Standard interface and PWM
GPIO control signalsDSP, ARM & FPGA Consumption Input:+5V, consumption about 30 W With heat dissipation Size Less than ø150 mm Weight Less than 500 g Contains structural parts Table 1. Feature summary of integrated miniaturized information processor
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该方案提炼抽象光电导引头数字信号处理需求,优化传感器信号采集模式,梳理信息处理功能和特点,均衡地分配到DSP和FPGA的数字信号处理计算单元和实时多任务处理单元,以DSP提供的丰富外设和FPGA高速数据传输接口为基础,以大容量高速宽带DDR3/DDR4和FLASH为保障,以多核DSP实时多任务快速响应调度为中心,充分利用高速多核DSP软件并行计算和大规模FPGA超长流水线硬件并行计算优势,综合集成传统光电导引头冗余信号和信息处理功能,优化部件间数据传输,减少了各部件重复DSP、FPGA、CPU和存储器等硬件资源,提高了资源利用率。具有系统体积小、重量轻、通信接口简单、综合成本和功耗更低等显著优势,但也存在设计难度大、软件开发集成要求高、测试性较差、故障定位困难、维修更换成本较高等缺点。光电导引头的工程研制需结合具体应用选择信息处理总体方案。
Design of information processing system for photoelectric seeker
doi: 10.3788/IRLA20200312
- Received Date: 2020-08-25
- Rev Recd Date: 2020-08-30
- Available Online: 2020-09-22
- Publish Date: 2020-09-22
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Key words:
- photoelectric seeker /
- information processing /
- distributed modular /
- integrated and miniaturized
Abstract: The photoelectric seeker is an important part of intelligent ammunition, and information processing is the core key technology of its precision guidance. From the perspective of engineering application, the main tasks and technical requirements of the information processing of the photoelectric seeker were systematically analyzed, and the classic distributed modular information processing design technical schemes were sorted out, and its significant advantages and main disadvantages were summarized. With the changes in the requirements of precision guided weapons in future combat objectives, environments and missions, in order to adapt to the development trend of multi-mode composite, intelligent, miniaturized, lightweight and low-cost photoelectric seekers, better meet the constraints of the missile environment urgent needs, make full use of the innovative results of VLSI and information processing technology, in the overall architecture of the photoelectric seeker system, the design ideas of integrated and miniaturized information processing were put forward, and typical application schemes was got, and the core performance was designed. It has significant advantages in terms of comprehensive cost and power consumption, and has strong versatility, which is conducive to the integration of missile guidance platform architecture, missile serialization and upgrading, and provides a reference for the development of a new generation of advanced photoelectric seeker engineering.