[1]
[2] Wang Zhenglun. Laser ignition and other ignition mode analysis in the artillery [J]. Infrared and Laser Engineering, 2008, 37(S): 422-425. (in Chinese) 王争论. 激光点火及其他点火方式在火炮分析中的研究[J]. 红外与激光工程, 2008, 37(S): 422-425.
[3]
[4] Zhang Jun. Semiconductor laser beam technology and application[J]. Infrared and Laser Engineering, 2012, 41(12): 3193-3197. (in Chinese) 张俊. 半导体激光合束技术及其应用[J]. 红外与激光工程, 2012, 41(12): 3193-3197.
[5] Wang Xu. Evaluation of the RB-SiC mirror surface fabricated with the fixed abrasive technology [J]. Infrared and Laser Engineering, 2012, 41(9): 2474-2479. (in Chinese) 王旭. 固着磨料工艺加工碳化硅反射镜表面质量研究[J]. 红外与激光工程, 2012, 41(9): 2474-2479.
[6]
[7]
[8] Sundararajan S, Thakurta D G, Schwendeman D W, et al. Two-dimensional wafer-scale chemical-mechanical planarization models based on lubrication theory and mass transport [J]. Journal of the Electrochemical Society, 1999, 146(2): 761-766.
[9]
[10] Park S S, Cho C H, Ahn Y. Hydrodynamic analysis of chemical mechanical polishing process [J]. Tribology International, 2000, 33(10): 723-730.
[11]
[12] Cho C H, Park S S, Ahn Y. Three-dimensional wafer scale hydrodynamic modeling for chemical mechanical polishing[J]. Thin Solid Films, 2001, 389(1-2): 254-260.
[13]
[14] Kim A T, Seok J, Tichy J A, et al. A multiscale elastohydrodynamic contact model for CMP [J]. Journal of the Electrochemical Society, 2003, 150(9): 570-576.
[15] Koshy P, Jain V K, Lal G K. Stochastic simulation approach to modelling diamond wheel topography [J]. International Journal of Machine Tools and Manufacture, 1997, 37 (6): 751-761.
[16]
[17] Chen X, Rowe W B. Analysis and simulation of the grinding process. Part I: generation of the grinding wheel surface[J]. International Journal of Machine Tools and Manufacture, 1996, 36 (8): 871-882.
[18]
[19] Syoji K, Zhou L B, Matsui S. Studies on truing and dressing of diamond wheels [J]. Bulletin of the Japan Society for Precision Engineering, 1990, 24(2): 124-129.