[1] Tissot J. IR detection with uncooled sensors [J]. Infrared Physics & Technology, 2004, 46(1-2): 147-153.
[2] Song W B. Fabrication of adaptive microbolometers[C]//Proceedings of SPIE the International Society for Optical Engineering, 2004, 5406: 566-576.
[3] Cole B, Horning R, Johnson B, et al. High performance infrared detector arrays using thin film microstructures[C]//Proceedings of 1994 IEEE International Symposium on Applications of Ferroelectrics, 1994, 653~656
[4] 雷述宇, 方辉, 刘俊, 等. 国产640×512 非制冷氧化钒红外焦平面探测器的研制[J]. 红外技术, 2013, 35(12): 759-763. doi:  10.11846/j.issn.1001_8891.201312003

Lei Shuyu, Fang Hui, Liu Jun, et al. Research on domestic 640×512 uncooled VOx infrared focal plane array [J]. Infrared Technology, 2013, 35(12): 759-763. (in Chinese) doi:  10.11846/j.issn.1001_8891.201312003
[5] Becker S, Imperinetti P, Yon J J, et al. Latest pixel size reduction of uncooled IR-FPA at CEA, LETI[C]//Proceedings of SPIE the International Society for Optical Engineering, 2012, 8541: 85410C.
[6] 李华高, 杨子文, 刘爽. 非制冷红外探测器用VOx薄膜的制备[J]. 半导体光电, 2001, 22(1): 38-40. doi:  10.3969/j.issn.1001-5868.2001.01.010

Li Huagao, Yang Ziwen, Liu Shuang. Preparation of VOx films for uncooled infrared detectors [J]. Semiconductor Optoelectronics, 2001, 22(1): 38-40. (in Chinese) doi:  10.3969/j.issn.1001-5868.2001.01.010
[7] Niklaus F, Vieider C, Jakobsen H. MEMS-based uncooled infrared bolometer arrays: a review[C]//Proc SPIE, 2008, 6836: 68360D.
[8] Hay A K A. Large format VOx microbolometer UFPA development at ITC[C]//Proceedings of SPIE-The International Society for Optical Engineering, 2006, 6295: 629505.
[9] Zhao Y, Mao M Y, Horowitz R, et al. Optomechanical uncooled infrared imaging system: design, microfabrication, and performance [J]. Journal of Microelectromechanical Systems, 2002, 11(2): 136-146. doi:  10.1109/84.993448
[10] 冯涛, 金伟其, 司俊杰. 非制冷红外焦平面探测器及其技术发展动态[J]. 红外技术, 2015, 37(3): 177-184. doi:  10.11846/j.issn.1001_8891.201503001

Feng Tao, Jin Weiqi, Si Junjie. Uncooled infrared FPA−A review and forecast [J]. Infrared Technology, 2015, 37(3): 177-184. (in Chinese) doi:  10.11846/j.issn.1001_8891.201503001