[1]
|
Jin Huaqun. A study on forced air cooling and thermal con-trol through phase-change of fusible material[J]. Electro-Mechanical Engineering, 2005, 21(6): 25-28. (in Chinese)金华群. 强迫空气加相变散热研究[J]. 电子机械工程, 2005, 21(6): 25-28. |
[2]
|
Mudawar I. Assessment of high-heat-flux thermal man-agement schemes[J]. IEEE Transactions on Components and Packaging Technologies, 2001, 24(2): 122-141. |
[3]
|
Zhang Dexin, Ma Guangfu, Qu Guozhi. Design of super-wide-angle aerial reconnaissance CCD camera[J]. Infrared and Laser Engineering, 2010, 39(6): 1060-1065. (in Chinese)张德新, 马广富, 曲国志. 宽角航空侦察CCD相机设计[J]. 红外与激光工程, 2010, 39(6): 1060-1065. |
[4]
|
Ding Yanwei, Lu E. Thermal design of CCD driver and its temperature changing in the course of taking picture of space remote sensor[J]. Optical Technique, 2003, 29(2): 172-176. (in Chinese)丁延卫, 卢锷. 遥感器CCD驱动器热设计及其在摄像过程中的温度变化[J]. 光学技术, 2003, 29(2): 172-176. |
[5]
|
Luo Zhitao, Xu Shuyan, Chen Liheng. Thermal control of high-power focal plane apparatus[J]. Optics and Precision Engineering, 2008, 16(11): 2187-2192. (in Chinese)罗志涛, 徐抒岩, 陈立恒. 大功率焦平面器件的热控制[J]. 光学精密工程, 2008, 16(11): 2187-2192. |
[6]
|
Guo Liang, Wu Qingweng, Yan Changxiang, et al. Thermal design and verification of CCD components in spectral imagers at steady and transient states[J]. Optics and Precision Engineering, 2010, 18(11): 2375-2383. (in Chinese)郭亮, 吴清文, 颜昌翔, 等. 光谱成像仪CCD组件的稳态/瞬态热分析与验证[J]. 光学 精密工程, 2010, 18(11): 2375-2383. |
[7]
|
Zhou Wei, Zhang Fang, Wang Xiaoqun. Prospect of thermal con-trol phase change in electronic devices[J]. Chinese Journal of Electron Devices, 2007, 30(1): 344-348. (in Chinese).周伟, 张芳, 王小群. 相变温控在电子设备上的应用研究进展[J]. 电子器件. 2007, 30(1): 344-348. |
[8]
|
Belén Z, José M M, Luisa C F, et al. Review on thermal energy storage with phase change: materials, heat transfer analysis and applications[J]. Applied Thermal Engineering, 2003, 23: 251-283. |
[9]
|
Pasupathy A, Athanasius L, Seeniraj R V, et al. Experimental investigation and numerical simulation analysis on the thermal performance of a building roof incor-porating phase change material(PCM) for thermal management[J]. Applied Thermal Engineering, 2008, 28: 556-565. |
[10]
|
Xu Weiqiang, Yuan Xiugan. Heat absorbing and releas-ing experiments with improved phase-change thermal storage canisters[J]. Chinese Journal of Aeronautics, 2010, 23: 306-311. |
[11]
|
Nayak K C, Saha S K, Srinivasan K, et al. A numerical model for heat sinks with phase change materials and thermal conductivity enhancers[J]. International Journal of Heat and Mass Transfer, 2006, 49: 1833-1844. |
[12]
|
Halawa E, Saman W. Thermal performance analysis of a phase change thermal storage unit for space heating[J]. Renewable Energy, 2011, 36: 259-264. |
[13]
|
Qiu Yifen, Jiang Nan, Wu Wei, et al. Heat transfer of heat sinking vest with phase-change material [J]. Chinese Journal of Aeronautics, 2011, 24: 720-725. |
[14]
|
Hu Chuanxi, Yang Aidi, Liu Ying, et al. Phase change micro-encapsulation and thermal infrared stealth coating[J]. Infrared and Laser Engineering, 2009, 38(3): 485-488. (in Chinese)胡传炘, 杨爱弟, 刘颖, 等. 相变微胶囊与热红外隐身[J]. 红外与激光工程, 2009, 38(3): 485-488. |
[15]
|
Bi Xiaoping, Zhou Guoyin, Lv Liangdong, et al. Heat transfer analyzing of phase change infrared restraining device on tank′s high temperature surface[J]. Infrared and Laser Engineering, 2012, 41(4): 838-842. (in Chinese)毕小平, 周国印, 吕良栋, 等. 坦克高温表面相变红外抑制装置传热分析[J]. 红外与激光工程, 2012, 41(4): 838-842. |
[16]
|
Mustapha F, Hamid E Q, El K L. Thermal analysis of a phase change material based heat sink for cooling protruding electronic chips[J]. Journal of Thermal Science, 2009, 18(3): 268-275. |
[17]
|
Wu Bin, Xing Yuming. Numerical investigation of phase change thermal control unit for portable electronic devices[J]. Journal of Beijing University of Aeronautics and Astronautics, 2010, 36(11): 1330-1334. (in Chinese)吴斌, 刑玉明. 移动电子设备相变热控单元热性能的数值仿真[J]. 北京航空航天大学学报, 2010, 36(11): 1330-1334. |
[18]
|
Maciej J. Thermal performance of heat spreader for electronics cooling with incorporated phase change material[J]. Applied Thermal Engineering, 2003, 35: 212-219. |
[19]
|
Ravi K, Wang X Q, Arun S M. Application of phase change materials in thermal management of electronics[J]. Applied Thermal Engineering, 2007, 27: 2822-2832. |
[20]
|
Alawadhi E M, Amon C H. PCM thermal control unit for portable electronic devices: experimental and nu-merical studies[J]. IEEE Transactions on Components and Packaging Technologies, 2003, 26(1): 116-125. |
[21]
|
Hou Zengqi, Hu Jingang. Spacecraft Thermal Control Technique: Theory and Application[M]. Beijing: China Science and Technology Press, 2007: 177-188. (in Chinese)侯增祺, 胡金刚. 航天器热控制技术-原理及其应用[M]. 北京: 中国科学技术出版社, 2007: 177-188. |