王希, 刘英杰, 张子萌, 王嘉宁, 姚勇, 宋清海, 徐科. 2 μm波段片上光子集成器件的研究进展(特邀)[J]. 红外与激光工程, 2022, 51(3): 20220087. DOI: 10.3788/IRLA20220087
引用本文: 王希, 刘英杰, 张子萌, 王嘉宁, 姚勇, 宋清海, 徐科. 2 μm波段片上光子集成器件的研究进展(特邀)[J]. 红外与激光工程, 2022, 51(3): 20220087. DOI: 10.3788/IRLA20220087
Wang Xi, Liu Yingjie, Zhang Zimeng, Wang Jianing, Yao Yong, Song Qinghai, Xu Ke. Research progress in 2 μm waveband on-chip photonic integrated devices (Invited)[J]. Infrared and Laser Engineering, 2022, 51(3): 20220087. DOI: 10.3788/IRLA20220087
Citation: Wang Xi, Liu Yingjie, Zhang Zimeng, Wang Jianing, Yao Yong, Song Qinghai, Xu Ke. Research progress in 2 μm waveband on-chip photonic integrated devices (Invited)[J]. Infrared and Laser Engineering, 2022, 51(3): 20220087. DOI: 10.3788/IRLA20220087

2 μm波段片上光子集成器件的研究进展(特邀)

Research progress in 2 μm waveband on-chip photonic integrated devices (Invited)

  • 摘要: 随着大数据业务的迅速发展,为应对持续增长的带宽需求,光纤通信窗口逐渐从传统C波段向C+L波段拓展。探索新波段也成为了光通信领域迫切需要解决的关键问题。位于近红外与中红外之间的2 μm波段具有低传输损耗和宽增益谱范围等优势,有望成为下一个光纤通信和空间激光通信的窗口。在商用光电子器件尚不成熟的情况下,实验室条件下已实现单波100 Gbit/s光传输记录。与此同时,2 μm波段功能性器件的研究也成为备受关注的热点。文中重点介绍了2 μm波段硅光子器件的研究进展,以及基于III-V族、铌酸锂薄膜、氮化硅、硫系玻璃等其他材料的一系列功能性器件,最后对2 μm波段片上光子集成器的发展前景进行了展望。

     

    Abstract: Driven by the development in big data services, the conventional optical fiber communication window was shifting from C-band to C+L band to meet the continuously increasing demand for bandwidths. Exploiting new wavebands became a crucial problem within the optical communications community. The 2 μm spectral range between near-infrared and mid-infrared held advantages of low transmission loss and broad gain bandwidth, which made it a promising candidate for the next window of free space laser and optical fiber communications. Even though the commercialization of the 2 μm optoelectronic devices was at early stage, recorded single-lane 100 Gbit/s transmission had been achieved in the laboratory. In the meantime, developing functional elements in this wavelength range was attracting extensive interests. In this paper, the recent advances of 2 μm silicon photonic device were introduced. Photonic integrated components on other platforms like III-V, thin-film lithium niobate, silicon nitride, and chalcogenide glass were also discussed. Finally, the 2 μm was envisioned on-chip photonic integrated devices.

     

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