Volume 48 Issue 10
Oct.  2019
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Wang Tianhe, Liu Shuyang, Zhang Chen, Jia Xiaodong. Design and fabrication of DBR based on hyperspectral imaging chip[J]. Infrared and Laser Engineering, 2019, 48(10): 1017003-1017003(7). doi: 10.3788/IRLA201948.1017003
Citation: Wang Tianhe, Liu Shuyang, Zhang Chen, Jia Xiaodong. Design and fabrication of DBR based on hyperspectral imaging chip[J]. Infrared and Laser Engineering, 2019, 48(10): 1017003-1017003(7). doi: 10.3788/IRLA201948.1017003

Design and fabrication of DBR based on hyperspectral imaging chip

doi: 10.3788/IRLA201948.1017003
  • Received Date: 2019-06-05
  • Rev Recd Date: 2019-07-15
  • Publish Date: 2019-10-25
  • Aiming at the shortcomings of traditional hyperspectral imaging system, such as large volume and weight, complicated structure of optical machine and high cost, it was urgent to meet the needs of miniaturization. The research on the design and preparation of distributed Bragg reflector(DBR) in hyperspectral imaging chip was carried out, and the simulator of multilayer film structure was developed. The fabrication of 5-layer film DBR and 7-layer film DBR were completed according to the structural design. The visible/near-infrared spectrophotometer was used to measure the reflectivity of the DBR, and the simulator for comparison, due to the existence of flaw in the actual preparation of the DBR, resulting in a error of 3%, The multilayer film structure simulator can guide the preparation of the actual DBR and lay the foundation for the hyperspectral imaging chip.
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Design and fabrication of DBR based on hyperspectral imaging chip

doi: 10.3788/IRLA201948.1017003
  • 1. Tianjin Jinhang Institute of Technical Physics,Tianjin 300308,China

Abstract: Aiming at the shortcomings of traditional hyperspectral imaging system, such as large volume and weight, complicated structure of optical machine and high cost, it was urgent to meet the needs of miniaturization. The research on the design and preparation of distributed Bragg reflector(DBR) in hyperspectral imaging chip was carried out, and the simulator of multilayer film structure was developed. The fabrication of 5-layer film DBR and 7-layer film DBR were completed according to the structural design. The visible/near-infrared spectrophotometer was used to measure the reflectivity of the DBR, and the simulator for comparison, due to the existence of flaw in the actual preparation of the DBR, resulting in a error of 3%, The multilayer film structure simulator can guide the preparation of the actual DBR and lay the foundation for the hyperspectral imaging chip.

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