Packaging for Long Linear InGaAs FPA with two thermoelectric coolings

Xu Qinfei; Liu Dafu; Xu Lin; Zhang Jinglin; Zeng Zhijiang; Fan Cui; Li Xue; Gong Haimei

doi:10.3788/IRLA201948.1104005

Volume 48 Issue 11

Dec. 2019

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Article Navigation > Infrared and Laser Engineering > 2019 > 48(11): 1104005-1104005(7)

Xu Qinfei, Liu Dafu, Xu Lin, Zhang Jinglin, Zeng Zhijiang, Fan Cui, Li Xue, Gong Haimei. Packaging for Long Linear InGaAs FPA with two thermoelectric coolings[J]. Infrared and Laser Engineering, 2019, 48(11): 1104005-1104005(7). doi: 10.3788/IRLA201948.1104005

Citation:

Xu Qinfei, Liu Dafu, Xu Lin, Zhang Jinglin, Zeng Zhijiang, Fan Cui, Li Xue, Gong Haimei. Packaging for Long Linear InGaAs FPA with two thermoelectric coolings[J]. Infrared and Laser Engineering, 2019, 48(11): 1104005-1104005(7). doi: 10.3788/IRLA201948.1104005

Packaging for Long Linear InGaAs FPA with two thermoelectric coolings

doi: 10.3788/IRLA201948.1104005

Xu Qinfei^1,2,3,
Liu Dafu^1,2,
Xu Lin^1,2,
Zhang Jinglin^1,2,
Zeng Zhijiang^1,2,3,
Fan Cui^1,2,3,
Li Xue^1,2,
Gong Haimei^1,2

1.
State Key Laboratories of Transducer Technology,Shanghai Institute of Technical Physics,Chinese Academy of Sciences,Shanghai 200083,China;
2.
Key Laboratory of Infrared Imaging Materials and Detectors,Shanghai Institute of Technical Physics,Chinese Academy of Sciences,Shanghai 200083,China;
3.
University of Chinese Academy of Sciences,Beijing 100049,China

Received Date: 2019-07-12
Rev Recd Date: 2019-08-15
Publish Date: 2019-11-25

Abstract

In order to realize large scale, high spatial resolution and high spectral resolution, mechanical assembly technology was usually adopted to realize Long Linear assembly. The large cold plate of 120 mm was achieved through the mechanical assembly technology of two thermoelectric coolings. Packaging of Long Linear InGaA s focal plane array assembly with 4 000 pixels was adoped through the mechanical assembly technology. Temperature uniformity distribution of the Long Linear, the coplanar error of FPAs, and the engineering reliability of the assembly were studied. The temperature uniformity was controlled at 0.4℃, the focal plane array coplanar error was controlled inside 0.020 mm by mechanical assembly of thermoelectronic coolings, thermal analysis, selection of coolings material, tolerance control of component and micro regulation etc. The Long Linear InGaAs focal plane array shortwave infrared assembly had passed the impact and random vibration test, the focal plane array coplanar error was nearly unchanged. At last, a clear ground-imaging in the camera was abtained.
- Long Linear,
- InGaAs detector assembly,
- thermoelectric cooling,
- mechanical assembly,
- coplanar

References

[1]	Gong Haimei, Tang Hengjing, Li Xue, et al. Near infrared InGaAs FPAs for space applications[J]. Infrared and Laser Engineering, 2009, 38(4):574-582.
[2]	Porod W, Ferry D K. Modification of the virtual-crystal approximation for ternary Ⅲ-Ⅴ compounds[J]. Phys Rev B, 1983, 27(4):2587-2589.
[3]	Tang Hengjing. Technical study on InGaAs linear SWIR focal plane arrays[D]. Shanghai:Shanghai Institute of Technical Physics, CAS, 2008. (in Chinese)唐恒敬. 台面型InGaAs短波红外线列探测器技术研究[D]. 上海:中国科学院上海技术物理研究所, 2008.
[4]	Shao Xiumei, Li Tao, Deng Honghai, et al. Planar-type 241 InGaAs short wave infrared detectors[J]. Infrared Technology, 2011, 33(9):501-504. (in Chinese)邵秀梅, 李淘, 邓洪海, 等. 平面型24元InGaAs短波红外探测器[J]. 红外技术, 2011, 33(9):501-504.
[5]	Shao Xiumei, Gong Haimei, Li Xue, et al. Developments of high performance short-wave infrared InGaAs focal plane detectors[J]. Infrared Technology, 2016, 38(8):629-635. (in Chinese)邵秀梅, 龚海梅, 李雪, 等. 高性能短波红外InGaAs焦平面探测器研究进展[J]. 红外技术, 2016, 38(8):629-635.
[6]	Morio W, Haruo H. Wide wavalength and low dark current lattice-mismatched InGaAs/InAsP photodiodes grown by metalorganic vapor-phase epitaxy[J]. Appl Phys Lett, 1994, 64(10):1265-1267.
[7]	Hao Guoqiang, Zhang Yonggang, Gu Yi, et al. Temperature behavior of In0.53Ga0.47As PIN photodetectors[J]. Journal of Functional Materials and Devices, 2005, 11(2):192-196. (in Chinese)郝国强, 张永刚, 顾溢, 等. In0.53Ga0.47As PIN光电探测器的温度特性分析[J]. 功能材料与器件学报, 2005, 11(2):192-196.
[8]	Elsheikh M H, Shnawah D A, Sabri M F M, et al. A review on thermoelectric renewable energy:principle parameters that affect their performance[J]. Renewable Sustainable Energy Reviews, 2014, 30(2):337-355.
[9]	Guo Chen, Pan Kailin, Cheng Hao. Research progress of the thermoelectric refrigeration technology[J]. Micronanoelectronic Technolgy, 2018, 55(12):927-931. (in Chinese)郭琛, 潘开林, 程浩. 热电制冷技术的研究进展[J]. 微纳电子技术, 2018, 55(12):927-931.
[10]	Zhou Hao, Gu Jihua, Chen Daqing. Multi-plane imaging in digital holography[J]. Infrared and Laser Engineering, 2015, 44(2):513-518. (in Chinese)周皓, 顾济华, 陈大庆. 数字全息多平面成像技术研究[J]. 红外与激光工程, 2015, 44(2):513-518.
[11]	Zhou Shichun. Introduction to Advanced Infrared Optoelectronic Engineering[M]. Beijing:Science Press,2014. (in Chinese)周世椿. 高级红外光电工程导论[M]. 北京:科学出版社, 2014.
[12]	Xu Qinfei, Liu Dafu, Gong Haimei, et al. The quantificational spectrum control for low temperature integrated dual-band assembly[J]. Chinese Journal of Optics, 2017, 10(55):744-751. (in Chinese)徐勤飞, 刘大福, 龚海梅, 等. 双波段芯片集成封装组件的低温光谱定量化[J]. 中国光学, 2017, 10(55):744-751.
[13]	Pitts D, Sissom L. Heat Transfer[M]. 2nd ed. Translated by Ge Xinshi, Ye Hong, Chen Zeshao. Beijing:Science Press, 2002. (in Chinese) D Pitts, L Sissom. 传热学[M]. 第二版. 葛新石, 叶宏, 陈则韶, 译. 北京:科学出版社, 2002.
[14]	Li Guangzheng, Ma Honglin. The numerical simulation of natural convection in a closed cavity[J]. Journal of HUST (Urban Science Edition), 2004, 21(3):14-17. (in Chinese)李光正, 马洪林. 封闭腔内高瑞利数层流自然对流数值模拟[J]. 华中科技大学学报(城市科学版), 2004, 21(3):14-17.
[15]	Li Shiwu, Xiong Lifang. Study of natural convection in closed a square cavity[J]. Industrial Heating, 2007, 36(3):10-13. (in Chinese)李世武, 熊莉芳. 封闭方腔自然对流换热的研究[J]. 工业加热, 2007, 36(3):10-13.
[16]	Huang Chunyong, Wang Houhua. Natural convection heat transfer in the air-layer of insulating glass[J]. Journal of Chongqing University (Natural Science Edition), 2009, 32(7):809-814. (in Chinese)黄春勇, 王厚华. 中空玻璃空气夹层内的自然对流换热[J]. 重庆大学学报(自然科学版), 2009, 32(7):809-814.

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通讯作者: 陈斌, bchen63@163.com

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沈阳化工大学材料科学与工程学院沈阳 110142

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Packaging for Long Linear InGaAs FPA with two thermoelectric coolings

1. State Key Laboratories of Transducer Technology,Shanghai Institute of Technical Physics,Chinese Academy of Sciences,Shanghai 200083,China;

2. Key Laboratory of Infrared Imaging Materials and Detectors,Shanghai Institute of Technical Physics,Chinese Academy of Sciences,Shanghai 200083,China;

3. University of Chinese Academy of Sciences,Beijing 100049,China

Received Date: 2019-07-12

Rev Recd Date: 2019-08-15

Publish Date: 2019-11-25

Key words:

Abstract: In order to realize large scale, high spatial resolution and high spectral resolution, mechanical assembly technology was usually adopted to realize Long Linear assembly. The large cold plate of 120 mm was achieved through the mechanical assembly technology of two thermoelectric coolings. Packaging of Long Linear InGaA s focal plane array assembly with 4 000 pixels was adoped through the mechanical assembly technology. Temperature uniformity distribution of the Long Linear, the coplanar error of FPAs, and the engineering reliability of the assembly were studied. The temperature uniformity was controlled at 0.4℃, the focal plane array coplanar error was controlled inside 0.020 mm by mechanical assembly of thermoelectronic coolings, thermal analysis, selection of coolings material, tolerance control of component and micro regulation etc. The Long Linear InGaAs focal plane array shortwave infrared assembly had passed the impact and random vibration test, the focal plane array coplanar error was nearly unchanged. At last, a clear ground-imaging in the camera was abtained.

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Reference (16)

[1]	Gong Haimei, Tang Hengjing, Li Xue, et al. Near infrared InGaAs FPAs for space applications[J]. Infrared and Laser Engineering, 2009, 38(4):574-582.
[2]	Porod W, Ferry D K. Modification of the virtual-crystal approximation for ternary Ⅲ-Ⅴ compounds[J]. Phys Rev B, 1983, 27(4):2587-2589.
[3]	Tang Hengjing. Technical study on InGaAs linear SWIR focal plane arrays[D]. Shanghai:Shanghai Institute of Technical Physics, CAS, 2008. (in Chinese)唐恒敬. 台面型InGaAs短波红外线列探测器技术研究[D]. 上海:中国科学院上海技术物理研究所, 2008.
[4]	Shao Xiumei, Li Tao, Deng Honghai, et al. Planar-type 241 InGaAs short wave infrared detectors[J]. Infrared Technology, 2011, 33(9):501-504. (in Chinese)邵秀梅, 李淘, 邓洪海, 等. 平面型24元InGaAs短波红外探测器[J]. 红外技术, 2011, 33(9):501-504.
[5]	Shao Xiumei, Gong Haimei, Li Xue, et al. Developments of high performance short-wave infrared InGaAs focal plane detectors[J]. Infrared Technology, 2016, 38(8):629-635. (in Chinese)邵秀梅, 龚海梅, 李雪, 等. 高性能短波红外InGaAs焦平面探测器研究进展[J]. 红外技术, 2016, 38(8):629-635.
[6]	Morio W, Haruo H. Wide wavalength and low dark current lattice-mismatched InGaAs/InAsP photodiodes grown by metalorganic vapor-phase epitaxy[J]. Appl Phys Lett, 1994, 64(10):1265-1267.
[7]	Hao Guoqiang, Zhang Yonggang, Gu Yi, et al. Temperature behavior of In0.53Ga0.47As PIN photodetectors[J]. Journal of Functional Materials and Devices, 2005, 11(2):192-196. (in Chinese)郝国强, 张永刚, 顾溢, 等. In0.53Ga0.47As PIN光电探测器的温度特性分析[J]. 功能材料与器件学报, 2005, 11(2):192-196.
[8]	Elsheikh M H, Shnawah D A, Sabri M F M, et al. A review on thermoelectric renewable energy:principle parameters that affect their performance[J]. Renewable Sustainable Energy Reviews, 2014, 30(2):337-355.
[9]	Guo Chen, Pan Kailin, Cheng Hao. Research progress of the thermoelectric refrigeration technology[J]. Micronanoelectronic Technolgy, 2018, 55(12):927-931. (in Chinese)郭琛, 潘开林, 程浩. 热电制冷技术的研究进展[J]. 微纳电子技术, 2018, 55(12):927-931.
[10]	Zhou Hao, Gu Jihua, Chen Daqing. Multi-plane imaging in digital holography[J]. Infrared and Laser Engineering, 2015, 44(2):513-518. (in Chinese)周皓, 顾济华, 陈大庆. 数字全息多平面成像技术研究[J]. 红外与激光工程, 2015, 44(2):513-518.
[11]	Zhou Shichun. Introduction to Advanced Infrared Optoelectronic Engineering[M]. Beijing:Science Press,2014. (in Chinese)周世椿. 高级红外光电工程导论[M]. 北京:科学出版社, 2014.
[12]	Xu Qinfei, Liu Dafu, Gong Haimei, et al. The quantificational spectrum control for low temperature integrated dual-band assembly[J]. Chinese Journal of Optics, 2017, 10(55):744-751. (in Chinese)徐勤飞, 刘大福, 龚海梅, 等. 双波段芯片集成封装组件的低温光谱定量化[J]. 中国光学, 2017, 10(55):744-751.
[13]	Pitts D, Sissom L. Heat Transfer[M]. 2nd ed. Translated by Ge Xinshi, Ye Hong, Chen Zeshao. Beijing:Science Press, 2002. (in Chinese) D Pitts, L Sissom. 传热学[M]. 第二版. 葛新石, 叶宏, 陈则韶, 译. 北京:科学出版社, 2002.
[14]	Li Guangzheng, Ma Honglin. The numerical simulation of natural convection in a closed cavity[J]. Journal of HUST (Urban Science Edition), 2004, 21(3):14-17. (in Chinese)李光正, 马洪林. 封闭腔内高瑞利数层流自然对流数值模拟[J]. 华中科技大学学报(城市科学版), 2004, 21(3):14-17.
[15]	Li Shiwu, Xiong Lifang. Study of natural convection in closed a square cavity[J]. Industrial Heating, 2007, 36(3):10-13. (in Chinese)李世武, 熊莉芳. 封闭方腔自然对流换热的研究[J]. 工业加热, 2007, 36(3):10-13.
[16]	Huang Chunyong, Wang Houhua. Natural convection heat transfer in the air-layer of insulating glass[J]. Journal of Chongqing University (Natural Science Edition), 2009, 32(7):809-814. (in Chinese)黄春勇, 王厚华. 中空玻璃空气夹层内的自然对流换热[J]. 重庆大学学报(自然科学版), 2009, 32(7):809-814.

Packaging for Long Linear InGaAs FPA with two thermoelectric coolings

doi: 10.3788/IRLA201948.1104005

Abstract

References

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通讯作者: 陈斌, bchen63@163.com

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