Abstract: The infrared focal plane arrays(IRFPA) have been applied in various areas, e.g. safety, space exploration, environmental monitoring, industry control. Due to the characteristics of small amount and high price, reliability has become a major bottleneck problem for IRFPAs' development. As failure pixel, bad pixel is an objective reflection of IRFPA's performance, so it is very suitable for failure analysis and reliability evaluation. Bad pixels were divided into initial bad pixels(IBPs) and used bad pixels(UBPs) by the boundary of delivery time, and their characteristics were analyzed such as type, nature, quantity, location and distribution et al. At the same time, according to hybrid IRFPAs' structure, the cause of bad pixel was studied by three aspects: the detector chip, indium bump and ROIC. Meanwhile, the feasibility to study IRPFAs' damage stress, failure position, damage mechanism and device evaluation were discussed all around. The research of bad pixel can be used to optimize the structure and process, and it also can improve the accuracy of bad pixel identification and replacements.