γ射线辐照对130 nm部分耗尽SOI MOS器件栅氧经时击穿可靠性的影响

Effects of time-dependent dielectric breakdown reliability of 130 nm partially depleted SOI MOS devices exposed to γ-ray

  • 摘要: 研究了射线辐照对130 nm部分耗尽(Partially Depleted,PD)绝缘体上硅(Silicon on Insulator,SOI)工艺MOS器件栅氧经时击穿(Time-Dependent Dielectric Breakdown,TDDB)寿命的影响。通过测试和对比辐照前后NMOS和PMOS器件的转移特性曲线、阈值电压、关态泄漏电流以及TDDB时间等电参数,分析了射线辐照对PD-SOI MOS器件TDDB可靠性的影响。结果表明:由于射线辐照在栅极氧化层中产生了带正电的氧化物陷阱电荷,影响了器件内部势垒的分布,降低了电子跃迁的势垒高度,导致了电子遂穿的正反馈作用增强,从而缩短了器件栅氧化层经时击穿时间,最终造成器件栅极氧化层的可靠性下降。

     

    Abstract: The effects of -ray irradiation on the subsequent time-dependent dielectric breakdown (TDDB) of partially depleted (PD) silicon-on-insulator (SOI) MOS devices were investigated. By testing and comparing the transfer characteristic curves, threshold voltage, off-state leakage current, the TDDB lifetimes and other electrical parameters of the NMOS and PMOS devices before and after irradiation, the effects of -ray irradiation on the TDDB reliability of the devices were analyzed. The results show that the positively charged oxide trap charges induced by -ray irradiation in the gate oxide layer affected the distribution of the internal barrier of the device, and reduced the height of the barrier of the electron transition. Therefore, the positive feedback effect of electron tunneling is enhanced and the TDDB lifetime of the device is reduced, resulting in a reliability degradation of the gate oxide of the devices.

     

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