星载大孔径静态干涉高光谱成像仪高速成像电路设计

Design of high-speed imaging circuit of spaceborne LASIS hyperspectral imager

  • 摘要: 根据遥感领域高光谱成像对大幅宽、高分辨率需求,研制了一套适合航天LASIS高光谱成像应用的高分辨率、宽视场、高光谱、高可靠性的新型高速光谱成像仪电子学系统,它采用多片四通道并行处理ADC芯片进行模数转换,以V5系列FPGA为核心处理器,用高速SerDes芯片传输图像数据,成像测试及相关环境试验及可靠性测试,验证了设计的有效性。该设计为我国进入航天遥感领域领先行列提供了技术支撑,也为深入开展高分辨遥感提供了有益的借鉴。

     

    Abstract: According to the requirement of high resolution and wide range for hyperspectral imaging in the field of remote sensing, a high-speed spectral imager electronic system with high resolution and high reliability was developed, which was suitable for the application of Large Aperture Interferential Imaging Spectrometer(LASIS). The multiple four channel parallel ADC chips for analog-to-digital conversion was used, with V5 series FPGA as the core processor and high-speed SerDes chip for image data transmission. At last, the imaging performance and reliability of our high-speed imaging circuit were validated. All these measures provide technical support for China to enter the leading position in the field of space remote sensing, and also provide useful reference for further development of high-resolution hyperspectral imaging remote sensing.

     

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