Abstract: The new generation of aerospace remote sensing instruments are developing towards high spatial resolution, high energy resolution, and high time resolution. Its core components are high-performance large-scale small-pixel short-wave infrared InGaAs focal plane detectors. The latest research progress in the design and fabrication of high-density InGaAs detector arrays was reported, and hybrided with matching Si-CMOS readout circuits to form a focal plane. The breakthroughs in dark current and noise suppression of high-density small-pixel detectors , megapixel focal plane flip chip interconnection and other key technologies were focused. The new flip chip interconnection technologies such as high flatness chip surface shape control, indium bumps convex morphology and high consistency control, and high-density flip chip interconnection control were solved. Developed 10 μm pitch 2560×2 048 focal plane detectors, which D* was better than 1.0×10¹³ cm·Hz^1/2/W, the response non-uniformity was better than 3%, the effective pixel rate was better than 99.7%, and the dynamic range was better than 120 dB. This focal plane was used for laboratory demonstration imaging, and the picture was clear.