GaSb衬底厚度对超晶格电学特性影响的研究

Study on the electrical properties of superlattice influenced by the thickness of GaSb substrate

  • 摘要: 非故意掺杂的GaSb存在施主缺陷,呈现p型导电,导电性较好。对于分子束外延制备的Sb基超晶格材料,通常用GaSb做衬底,而GaSb衬底厚度远大于超晶格材料厚度,因此对锑基二类超晶格材料进行霍尔测试时GaSb衬底厚度对超晶格电学性能容易产生较大影响。而在红外探测器制备过程中,为了增加材料对红外辐射的吸收,通常在器件制备完成后对衬底进行减薄,通过背入射的方式对红外辐射进行探测,因此探究GaSb厚度对超晶格电学特性的影响能够为超晶格材料的结构设计提供理论依据。讨论了n型超晶格薄膜及p型超晶格薄膜的电学特性受GaSb衬底厚度的影响。使用由分子束外延技术在弱n型GaSb衬底上生长GaSb缓冲层后,分别生长Si掺杂的n型InAs/GaSb Ⅱ类超晶格及Be掺杂的p型InAs/GaSb Ⅱ类超晶格,衬底进行不同厚度的减薄,并进行霍尔测试。结果表明:在77 K温度下的霍尔测试中,虽然缓冲层减弱了衬底对超晶格薄膜的影响,但不能完全消除衬底对超晶格薄膜电学特性的影响。n型超晶格及p型超晶格的电学特性仍随衬底厚度变化产生:衬底厚度的减薄导致表面复合效应增加、杂质浓度重分布,因此超晶格材料载流子浓度的减小,载流子迁移率在相同的温度下受杂质散射影响较大,载流子浓度的减小降低了电子散射的可能性,因此迁移率随衬底厚度减薄而增加。n型超晶格载流子浓度及迁移率的变化均在同一量级,与缓冲层极性相反的薄膜材料减薄前的电学特性可以为减薄后的电学特性进行标定。p型超晶格载流子浓度变化相对较大,与缓冲层材料极性相同的材料在需要考虑载流子浓度时,材料生长过程中需要进行高浓度掺杂保证减薄后薄膜材料的载流子浓度,迁移率变化几乎可视为不变。该研究对标定不同类型掺杂浓度的超晶格材料可提供一定的参考意义。

     

    Abstract:
    Objective The undoped GaSb has a donor defect and exhibits p-type conduction with good electrical conductivity. GaSb is usually used as the substrate for Type-Ⅱ superlattice materials prepared by molecular beam epitaxy, and the thickness of GaSb substrate is much larger than the thickness of the superlattice material. The thickness of GaSb substrate tends to have a great influence on the electrical properties of Sb based Type-Ⅱ superlattice during Hall test (Fig.1). In the preparation process of infrared detector, in order to increase the absorption of infrared radiation by the material, the substrate is usually thinned after the preparation of the device, and the infrared radiation is detected by back-side illumination. Therefore, exploring the electrical characteristics of Type-Ⅱ superlattice influenced by GaSb thickness could provide theoretical basis for the structural design of superlattice.
    Methods The effect of GaSb substrate thickness on the electrical properties of n-type and p-type superlattice films is discussed. Molecular beam epitaxy technology is used to grow Type-Ⅱ superlattice. After the pdoped GaSb buffer layer is grown on the n-type GaSb substrate, Si-doped n-type InAs/GaSb Type-Ⅱ superlattice (Fig.5) and Be-doped p-type InAs/GaSb Type-Ⅱ superlattice (Fig.6) are grown respectively. The substrates are thinned by mechanical polishing with different thicknesses and Hall tests are performed immediately.
    Results and Discussions The results show that in the Hall test at 77 K temperature, the electrical properties of n doped superlattice and p-type superlattice vary with the thickness of the substrate. The carrier concentration and mobility of n-type InAs/GaSb Type-Ⅱ superlattice grown on GaSb substrate and buffer layer vary with the substrate thickness, but the variation is small within the same order of magnitude, which is mainly due to the fact that the Be-doped GaSb buffer layer attenuates the electrical influence of GaSb substrate on the superlattice material (Fig.7). The carrier concentration and mobility of p-type InAs/GaSb Type-Ⅱ superlattice grown on GaSb substrate and buffer layer change with substrate thickness in the same way as that of n-type superlattice films with substrate thickness: due to the presence of Be-doped GaSb buffer layer, the electrical influence of GaSb substrate on the superlattice material is attenuated, and the overall change changes are small, especially the mobility. The carrier concentration decreases with the thickness of GaSb substrate, and the mobility increases with the thickness of GaSb substrate (Fig.8). This result occurs for the following reasons: the decreasing of the superlattice material carrier concentration reduces the possibility of electron scattering result from the increased surface recombination effect and redistribution of impurity concentration, so the mobility increases with the thinning of the substrate thickness. The changes of carrier concentration and mobility of n-doped superlattice are of the same order of magnitude, and the electrical properties of thin film materials with opposite polarity to the buffer layer before thinning can be calibrated for the electrical properties of the materials after thinning. The change of carrier concentration in p-doped superlattice is relatively large.
    Conclusions Although the buffer layer attenuates the effect of the substrate on the superlattice film, the effect of the substrate on the electrical properties of the superlattice film cannot be completely eliminated. When considering the carrier concentration of materials with the same polarity as the buffer layer material, high concentration doping is required during the growth process of materials that require precise doping to ensure the carrier concentration of the thin film material after thinning. This change needs to be taken into account, and the change in carrier mobility could be treated as a constant. This paper is of reference significance for the carrier concentration calibrations of Sb based Type-Ⅱ superlattice materials with different doping concentrations.

     

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