Abstract: Micro devices of metal thin film may be directly processed by utilizing the UV laser at the wavelegth of 266 nm or 355 nm. However, due to the output power of UV laser is common lower at present, it is not suitable for directly processing the shine metal with the larger size and thick. In this experiment, in order to overcome the problems that shine metal possess the high reflectivity to the solid state laser of high power at 1064 nm and the fast heat dissipation, the resonant cavity and the scanning focusing system were optimized, then the laser single mode operation was realized and the power density was reached 1.592109W/cm2, which also make that the absorption of laser energy by atom changes into the absorption way by the plasma emission of the free electrons in the metal. Utlizing to the laser of average power of 50 W, repetition frequency of 500 Hz, spot diameter of 20 m, pulse duration of 80 ns, cutting velocity of 10 mm/s, the bigger copperplate with thick of 10 mm was directly processed accurately, the width and deepth of the groove by laser cutting were all 100 10 m, and the groove spacing was 30015 m, that were enough satisfied the initial target.