李攀, 刘元正, 雷兴, 李俊, 王继良. 石英玻璃低温键合界面的环境适应性试验[J]. 红外与激光工程, 2014, 43(12): 4035-4039.
引用本文: 李攀, 刘元正, 雷兴, 李俊, 王继良. 石英玻璃低温键合界面的环境适应性试验[J]. 红外与激光工程, 2014, 43(12): 4035-4039.
Li Pan, Liu Yuanzheng, Lei Xing, Li Jun, Wang Jiliang. Environmental adaptability tests for low temperature bonding interface of quartz glass[J]. Infrared and Laser Engineering, 2014, 43(12): 4035-4039.
Citation: Li Pan, Liu Yuanzheng, Lei Xing, Li Jun, Wang Jiliang. Environmental adaptability tests for low temperature bonding interface of quartz glass[J]. Infrared and Laser Engineering, 2014, 43(12): 4035-4039.

石英玻璃低温键合界面的环境适应性试验

Environmental adaptability tests for low temperature bonding interface of quartz glass

  • 摘要: 石英玻璃的低温键合技术作为一种可靠的固体连接方式,受到了欧美发达国家的广泛重视,并在航天、基础科研、强激光等诸多领域得到了广泛应用。该技术基于氢氧化物催化玻璃表面的水解/脱水过程,通过在键合界面之间形成硅酸盐三维网状结构实现键合,是一种高强度、高精确性、可靠的室温键合方法。对石英玻璃低温键合技术的工作原理和基本工艺过程进行了阐述,并实现了石英玻璃的低温键合。对键合界面进行了多项环境适应性试验,结果表明:相对传统的光胶方法,低温键合技术在键合强度、温度冲击环境及水环境的适应性方面表现出显著优势,在键合均匀性、精确度、透明度、密封性、常规温度及振动环境方面与传统方法表现相当。

     

    Abstract: Low temperature bonding for quartz glass as a reliable solid connection technology has received extensive attention in developed countries in Europe and America, and has been widely used in many fields such as aerospace, basic research, strong laser etc.. Low temperature bonding based on hydroxide-catalyzed hydration/dehydration at the glass surface is a low temperature bonding method with high breaking strength, high precision and high reliability by forming three-dimensional silicate networks at the interface. The physical principle and the basic process of low temperature bonding was demonstrated and the low temperature bonding for quartz glass was realized too. The results of the bonding interface of environmental adaptability test show that, compared with conventional optical contact method, low temperature bonding is superior in bonding strength and adaptability in temperature shock environment and water environment, while low temperature bonding matches optical contact in uniformity, precision, transparency, vacuum seal and adaptability in regular temperature environment and vibration environment.

     

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