王行行. 基于TMS320DM8168的视频编码系统研究与实现[J]. 红外与激光工程, 2014, 43(S1): 59-64.
引用本文: 王行行. 基于TMS320DM8168的视频编码系统研究与实现[J]. 红外与激光工程, 2014, 43(S1): 59-64.
Wang Hanghang. Research and implementation on video coding system based on TMS320DM8168[J]. Infrared and Laser Engineering, 2014, 43(S1): 59-64.
Citation: Wang Hanghang. Research and implementation on video coding system based on TMS320DM8168[J]. Infrared and Laser Engineering, 2014, 43(S1): 59-64.

基于TMS320DM8168的视频编码系统研究与实现

Research and implementation on video coding system based on TMS320DM8168

  • 摘要: 随着信息技术的进步,空间对地成像已朝着高清、多路方向发展.基于通用DSP和H.264/AVC视频编码标准的实时视频压缩系统,由于具有开发周期短、可靠性高、处理速度快、便于升级以及体积小、功耗低、适应性强等优点,可以为新的需求提供解决方案,研究基于通用DSP、采用先进视频压缩技术的实时视频编码器具有重要意义.为满足越来越多的高清视频采集、编码和传输的应用需求,基于TI的新一代多核DSP TMS320DM8168芯片,给出了方案的设计与实现,在该系统上实现了H.264视频编码算法,可对输入的双路1080p视频进行60 fps实时编码压缩.方案的主处理器只需一片DSP,与传统多路视频压缩方案需要多片处理器相比,这种高度集成方案降低了部件数量和物料(BOM)成本、功耗需求,缩小了PCB尺寸,提高系统集成度.

     

    Abstract: With the development of information technology, space imaging has been developed toward high-definition and multi-channel direction. Real-time video compression system, based on general-purpose DSP and H.264/AVC video coding standard, due to short development cycle, high reliability, high processing speed, ease of upgrades, small size, low power consumption and high adaptability, can provide a solution for the new requirements. Therefore, it is of great importance to study real-time video encoder based on general-purpose DSP and advanced video compression technology. To meet the application needs of more and more high-definition video capture, coding and transmission, TI's new generation multi-core TMS320DM8168 chip was used for development, and the design and implementation of system was proposed, and then the H.264 video encode algorithm was realized for dual 1080p input video. The main processor of the scheme needs only a piece of DSP. Compared with the traditional video compression schemes which need multi processor, this highly integrated scheme reduces the number of parts and materials(BOM)cost, power requirements and the size of PCB, and increases the system integration.

     

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