Abstract: A new laser diode feature in low cost, shock resistance, narrow pulse was introduced. The laser diode was packaged with epoxy resin which can not only satisfies the requirement of the space but also makes the packaging easier for the shaper could be fabricated with the packaging. To reduce the size and the influence of the parasitic effect of the circuit, a multi-chip module was used to make up the driving circuit and a set of unpacked chip was used to replace the common packed chip. A metal bracket was used as the pins and the cooler of the laser diode. In the test of the laser diode, the divergence angle of the laser diode with the shaper is 1.1 in the fast-axial direction and 3.3 in the slow-axial direction. The max peak power of the laser diode in this kind of packaging is 35 W and the width of the optical pulse is less than 50 ns.