Hua Ning, Li Huaiyang, Wang Youjun, Sui Meishen. Processing techniques of quartz glass wafer[J]. Infrared and Laser Engineering, 2016, 45(S2): 96-100. DOI: 10.3788/IRLA201645.S221003
Citation: Hua Ning, Li Huaiyang, Wang Youjun, Sui Meishen. Processing techniques of quartz glass wafer[J]. Infrared and Laser Engineering, 2016, 45(S2): 96-100. DOI: 10.3788/IRLA201645.S221003

Processing techniques of quartz glass wafer

  • Quartz glass wafer has been widely applied in semiconductor and optical industries. With the rapid development of semiconductor and optical technology, the demand for quartz glass wafer rapidly grows. And the requirements for the processing precision of quartz glass wafer are increasingly strict. In order to meet the customer's demand for quality and quantity of quartz glass wafer, and solving the problems of low processing efficiency, low product precision, non-standard testing and non-standard packaging, based on the actual feedbacks from the use of customer, and refer the processing experience and processing methods of silicon wafer and quartz substrate, the processing techniques of quartz glass wafer was studied from the material making, blank making, precision annealing, multitool cutting, shaping processing, precision polishing, product inspection, cleaning and packaging. Quartz glass wafer, which is produced by current production process, can meet the customer's demand for product quality. And the current production process achieves the mass production. These processing techniques have been validated by market, which can guide the practical operation.
  • loading

Catalog

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return