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具有光学多参量调控能力的光学超构表面可以任意构造近场和远场光波,已经成为基础研究和应用研究的理想平台。相对于传统光学元件,超构表面具有超轻、超薄及多功能集成的优势,且全电介质型超构表面效率高、加工与CMOS工艺兼容,这使得超构表面有望成为继折射光学元件和衍射光学元件的第三代新型光学元件,革新整个光学领域的面貌。然而,要真正实现光学超构表面从实验室走向实际应用,高分辨率、高精度、高深宽比、难加工材料、大面积、低成本的微纳结构的加工是关键。所以,文中总结了超构表面发展大概十年时间内的各类微纳加工方法及其在光学超构表面的应用,包括适用于小批量原理验证的直写类加工技术,如电子束、离子束、光子束直写,以及模板转移技术,包括投影式光刻、纳米压印等技术,还有一些新兴的纳米加工技术,如探针扫描和自组装技术。笔者等将这些方法的加工尺度、精度、适用波段和技术特点总结在表1中,这些加工方法各有优劣,其应用让光学超构表面得到迅速发展,但是距离超构表面的真正走向实际工程应用,仍然有很多问题需要解决。笔者等总结了以下几点光学超构表面加工方面的挑战和未来的发展趋势。
Process Feature size Applicable band Precision Process characteristics Direct
writing technologyElectron beam lithography <10 nm UV to infrared ~1 nm High resolution, high degree of freedom, low efficiency for large-scale or complicated pattern, subsequent pattern transfer process required Focused ion beam etching ~20 nm Visible to infrared <100 nm High resolution, high degree of freedom, no material selectivity, ultralow efficiency Laser direct writing ~1 μm Visible to terahertz <1 μm High degree of freedom, resolution is limited by the optical diffraction limit, subsequent pattern transfer process required Ultrafast direct laser etching <200 nm <100 nm No material selectivity, minimal thermal effect, low-damage-threshold Two-photon (multiphoton) lithography <200 nm <100 nm Higher resolution than single photon lithography, high spatial selectivity, three-dimensional structures processing Scanning probe lithography <10 nm Visible to infrared <10 nm Simple process, low efficiency Template transfer technology Immersion lithography <100 nm Visible to infrared <100 nm High resolution, high alignment accuracy, high equipment cost, high requirements of processing Plasmonic lithography ~100 nm Visible to infrared <100 nm High-resolution, high processing efficiency, short working life, poor fidelity Hot embossing Depend on the master - - Relatively simple process, time consuming which is not suitable for mass production UV-curable nanoimprint lithography Nanoscale High efficiency, material selectivity Laser assisted direct imprint ~10 nm High-resolution, low heat release during processing, short processing time Micro-contact printing <100 nm Low cost, suitable for large-area or simple pattern processing Self-assembly lithography nm - μm - ~1 nm Low cost, suitable for large-area or simple pattern processing, simple process Table 1. Summary of fabrication methods of metasurfaces and their process characteristics
(1)目前的光学超构表面加工大部分集中在新原理、新功能的验证,但是加工的器件性能和仿真差距很大。这是由于目前的加工中很少考虑材料本征特性误差、尺寸误差、形状误差、超构单元倒塌缺失等一系列加工误差引起的性能下降。如果要实现超构表面真正走向应用,则需要系统研究加工误差与器件性能之间的定量关系,建立微纳加工误差评价体系和标准以指导超构表面产业化生产;需要研究各类加工方法中导致误差的原因以及如何优化工艺控制加工误差以实现高质量光学超构表面的加工。
(2)目前的直写加工技术仅适用于科研领域小面积验证和模板制备,而真正应用则需要如投影式曝光或纳米压印的大面积模板转移技术。而半导体产业先进的投影式曝光技术使用门槛和成本都很高,自由度和定制化能力不强,所以适用于有超大市场需求的单一产品的加工。纳米压印设备成本相对较低,且更适用于高自由度、定制化的光学元件加工。因此,一方面,目前超构表面元件发展初期的应用更适合利用纳米压印技术在玻璃晶圆上进行压印加工,以加工各类不同的光学元件满足不同场景的替代,但需要解决大面积模板制备和高折射率压印胶材料问题。另一方面,也需要探索超构表面能够取代传统光学元件并具有大批量需求的应用场景,以驱动半导体玻璃晶圆加工产业链整合升级,实现光学超构表面的批量化生产。
(3)目前的超构表面加工采用的是微纳加工一些共性设备和工艺,虽然可以满足大部分的超构表面加工要求,但是,随着超构表面的不断发展以及概念的拓展,各种新原理、新设计、新结构会不断涌现,已有的加工装备和工艺已经满足不了这些特殊的加工要求。因此,在超构表面发展的同时,也要发展超构表面加工的专用装备和工艺,以实现与超构表面发展协同良性发展,促进超构表面真正走向产业应用。
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