Al micropore array wet etching

Microchannel plate is the key component of the image intensifier. Compared with traditional MCP, Si-MCP has a great improvement in performance. Before DRIE in Si, the wet etching is necessary in the Al film. As the film pattern was the big area and periodic micropore with the pore of 10 m, the pitch of 5 m, the micropore resulted in the H2 absorbing on the reaction interface easily and affecting on the reaction. Meanwhile, the arrayed micropore pattern would appear random corrosion, incomplete corrosion and over etching because of the inappropriate corrosion parameters. By adding surfactants, the surface stress can be reduced, which can promote the reaction H2 discharge. By individually controlling variable, the affects of the corrosive concentration, temperature and the etching time on the result were focused. The results shows the corrosion rate is proportional to the corrosive concentration and temperature. By optimizing parameters, the best corrosion parameter is got. The pattern is complete and the size is accurate. The pattern of the arrayed micropore is solved which has a important significance to the DRIE.